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Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
kyzen
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Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
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Rick Fiacco


Global Director of Sales
APS Novastar

Rick Fiacco has 30 years experience in Interconnect Industry with a focus on Product Development/Marketing and Business Development. Fiacco holds two patents in cable and connectors. Presently he is responsible for all solder equipment at APS Novastar.

Rick Fiacco has submitted responses to the following questions.
Best Way to Eliminate Dross?
The majority of Dross is created when solder comes in contact with Oxygen. The best way to reduce Dross creation ...
Wave Solder Pallets
If the high temperature (350c) Durostone pallets are in good shape and can be cleaned thoroughly, they should be able ...
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Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura