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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Scott F. Cain
Global PCB Sales Manager
InsulFab PCB Tooling
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Scott Cain is the Sales Manager for the premier PCB Tooling Solution company in the industry, InsulFab PCB Tooling. Cain has seen every application and has worked with process engineers to create a solution to increase their yield and decrease the human interaction.
Scott F. Cain has submitted responses to the following questions.
Source of Wave Solder Bridging
After investigating the variables you listed if you are still having bridging problems it would be adventageous to discuss this ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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