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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Scott F. Cain
Global PCB Sales Manager
InsulFab PCB Tooling
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Scott Cain is the Sales Manager for the premier PCB Tooling Solution company in the industry, InsulFab PCB Tooling. Cain has seen every application and has worked with process engineers to create a solution to increase their yield and decrease the human interaction.
Scott F. Cain has submitted responses to the following questions.
Source of Wave Solder Bridging
After investigating the variables you listed if you are still having bridging problems it would be adventageous to discuss this ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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