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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Tim Kardish
CEO
APS Novastar
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Tim Kardish is a technology business leader with 26+ years experience in the PCB, SMT and AOI assembly equipment industry. Tim is the CEO and a member of the Board of Directors at APS Novastar, LLC. He is a member of IPC and SMTA.
Tim Kardish has submitted responses to the following questions.
Source of Wave Solder Bridging
Bridging during a wave soldering process can be attributed to a combination of factors. Since consistent and effective thru-hole component ...
Best Way to Eliminate Dross?
There are several processes to reduce dross contamination from a tin/lead solder pot. Dross is formed when molten solder on ...
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