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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
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Ask the Experts Member

Tim Kardish

CEO
APS Novastar

Tim Kardish is a technology business leader with 26+ years experience in the PCB, SMT and AOI assembly equipment industry. Tim is the CEO and a member of the Board of Directors at APS Novastar, LLC. He is a member of IPC and SMTA.

Tim Kardish has submitted responses to the following questions.

Components Lifting During Wave Soldering
Aside from component clinching we offer the following suggestions: For components of varied thermal demand increase solder immersion time For ...

Source of Wave Solder Bridging
Bridging during a wave soldering process can be attributed to a combination of factors. Since consistent and effective thru-hole component ...

Best Way to Eliminate Dross?
There are several processes to reduce dross contamination from a tin/lead solder pot. Dross is formed when molten solder on ...

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Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas