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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
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Ask the Experts Member

Tim Kardish

CEO
APS Novastar

Tim Kardish is a technology business leader with 26+ years experience in the PCB, SMT and AOI assembly equipment industry. Tim is the CEO and a member of the Board of Directors at APS Novastar, LLC. He is a member of IPC and SMTA.

Tim Kardish has submitted responses to the following questions.

Components Lifting During Wave Soldering
Aside from component clinching we offer the following suggestions: For components of varied thermal demand increase solder immersion time For ...

Source of Wave Solder Bridging
Bridging during a wave soldering process can be attributed to a combination of factors. Since consistent and effective thru-hole component ...

Best Way to Eliminate Dross?
There are several processes to reduce dross contamination from a tin/lead solder pot. Dross is formed when molten solder on ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
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