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Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
kyzen
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Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
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Tim Kardish


CEO
APS Novastar

Tim Kardish is a technology business leader with 26+ years experience in the PCB, SMT and AOI assembly equipment industry. Tim is the CEO and a member of the Board of Directors at APS Novastar, LLC. He is a member of IPC and SMTA.

Tim Kardish has submitted responses to the following questions.
Components Lifting During Wave Soldering
Aside from component clinching we offer the following suggestions: For components of varied thermal demand increase solder immersion time For ...
Source of Wave Solder Bridging
Bridging during a wave soldering process can be attributed to a combination of factors. Since consistent and effective thru-hole component ...
Best Way to Eliminate Dross?
There are several processes to reduce dross contamination from a tin/lead solder pot. Dross is formed when molten solder on ...
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Sponsor
Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura