Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist. Master Bond
Matt Stevenson has over 20 years experience in the PCB industry. Serving in roles as a Chemical Lab Technician, Process Engineer, Quality Engineer, Quality Manager, and Marketing Manager. He has proven himself to be an invaluable resource.
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
