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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Matt Stevenson
Director of Marketing
Sunstone Circuits
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Matt Stevenson has over 20 years experience in the PCB industry. Serving in roles as a Chemical Lab Technician, Process Engineer, Quality Engineer, Quality Manager, and Marketing Manager. He has proven himself to be an invaluable resource.
Matt Stevenson has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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