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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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John Perrotta
VP, Europlacer North America
Europlacer North America
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John Perrotta has been directly involved in the SMT Industry since 1995. John was formally educated in Applied Statistics and Manufacturing Engineering. He has 20 years of experience in Business Management, R&D, Sales/Marketing, Quality Assurance, and Manufacturing Engineering.
John Perrotta has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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