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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Raimund Faber
General Manager Sales & Marketing
SMT-Wertheim
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Raimund Faber has a strong background in the field of reflow soldering process, metalization process for solar cell backend application, and process engineering. He has many articles and white papers in different magazines, latest one will come up on July 12th at U.S. Tech magazine with wicking up phenomena.
Raimund Faber has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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