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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Outsourcing: A Risk You Can't Afford
Stop risking delays, tariffs, and rising costs with overseas PCB assembly. Bring production in-house with Manncorp for speed, precision, and total control—future-secured.
Manncorp Inc.
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Ask the Experts Member |
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Raimund Faber
General Manager Sales & Marketing
SMT-Wertheim
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Raimund Faber has a strong background in the field of reflow soldering process, metalization process for solar cell backend application, and process engineering. He has many articles and white papers in different magazines, latest one will come up on July 12th at U.S. Tech magazine with wicking up phenomena.
Raimund Faber has submitted responses to the following questions.
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Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
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ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
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