Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Raimund Faber

General Manager Sales & Marketing

SMT-Wertheim

Raimund Faber has a strong background in the field of reflow soldering process, metalization process for solar cell backend application, and process engineering. He has many articles and white papers in different magazines, latest one will come up on July 12th at U.S. Tech magazine with wicking up phenomena.

Raimund Faber has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling