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August 25, 2015 - Updated August 19, 2015 - Originally Posted Max Peak Topside Reflow TemperatureIPC-7095C 6.4.2 discusses the maximum peak topside board temperature for BGAs to be 150C during tin/lead wave solder. Does anyone know how this temperature was determined? Are there supporting research papers or other IPC standards with more information? In the figure 6-25 there is a peak temperature listed for fine pitched components of 160C. Is there another standard that goes into this in more detail? S.M. |
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| Expert Panel Responses | |||||||
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Dusting off the memory cells, I believe the maximum 150C topside board temperature relates to the nominal glass transition temperature of FR4. References may include IPC TM-650 or NEMA. This temperature was established prior to the implementation of lead-free soldering and the use of laminates accommodating higher temperatures.
Regional Sales Manager Finetech Al Cabral is Regional Sales Manager for Finetech and Martin rework products. His expertise includes through-hole, surface mount and semiconductor packaging with an emphasis on soldering and heat transfer. Al has been a significant contributor to the development and optimization of reflow and rework processes and systems, particularly lead-free transitions and microelectronic applications.
S.M. should check J-STD-020D, section 4, tables 4-1 and 4-1.
Director, EHS TTM Technologies Lee Wilmot has 20+ years doing EHS work in the PCB/PCBA industries, including environmental compliance, OSHA compliance, workers compensation, material content declarations, RoHS & REACH compliance. Active on IPC EHS committee and c-chaired committees on IPC-1331, J-STD-609A on labeling & marking, IPC-1758 on packaging and others.
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