circuitnet
Sponsor
Summit Interconnect
Webinar on Sep. 25 at 11:00 AM PT
IPC Standards for Quick-Turn, Prototype PCB Assembly: Learn practical insights into how standards impact the speed & reliability of prototype builds.
Summit Interconnect
M828
Sponsor
Nordson Electronics Solutions
Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
December 2, 2013 - Updated
November 19, 2013 - Originally Posted

Question About SN100 Solder

Is there any published reliability data on SN100 for SMT reflow applications? We currently use SAC305, but one manufacturer is suggesting SN100 low residue no-clean.
W.P.
Expert Panel Responses
Both DfR Solutions and iNEMI have published data onSN100C performance. For the most part, it falls in between SAC305 and SnPb.

Dr. Craig D. Hillman
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
Thereis some data available. The vast majority of data is still by far on the SAC305default lead-free alloy since alloy accounts for 99% of users and has been inuse for over 10 years now. Thereare a few users of SnCu based solder pastes right now although cost reductionpressures are pushing for these alternatives having low or no silver.Onecharacteristic that is noted by experience is a lesser wetting using SnCu basedsolders, so there are process changes required if you are to maintain solderjoint reliability. Ido not believe it is a drop in and some stencil design and reflow profilechanges are required for its implementation to be truly successful.Some high reliability customers also engage on extensive tests toconfirm joint metallurgy is within their expectations.

Peter Biocca
Peter Biocca
Senior Market Development Engineer, Kester
Mr. Biocca was a chemist with many years experience in soldering technologies. He presented around the world in matters relating to process optimization and assembly. He was the author of many technical papers delivered globally. Mr. Biocca was a respected mentor in the electronics industry. He passed away in November, 2014.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasma Etch
Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch
REL61