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August 17, 2011

BGA Corner Ball Bridging

We are having a problem with BGA component bridging. The problem is specific to one corner ball location on one BGA, but is common to a significant number of circuit board assemblies. What could be causing this consistent BGA bridging problem?

A. S.

Expert Panel Responses

This is a classic symptom of too much top heat. This excessive heating causes the weaker corners of the BGA to flex and bridge. Increase your subzone temperature and reduce the topside temperature.

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Edward Zamborsky
Regional Sales Manager
OK International Inc.
Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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