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August 17, 2011
BGA Corner Ball Bridging We are having a problem with BGA component bridging. The problem is specific to one corner ball location on one BGA, but is common to a significant number of circuit board assemblies. What could be causing this consistent BGA bridging problem? A. S. |
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This is a classic symptom of too much top heat. This excessive heating causes the weaker corners of the BGA to flex and bridge. Increase your subzone temperature and reduce the topside temperature.
Regional Sales Manager OK International Inc. Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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