|
Sponsor
|
|
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
November 5, 2009 - Updated
November 2, 2009 - Originally Posted
What Is The Ideal HASL Thickness?
What is the ideal solder thickness for hot air solder leveled (HASL) lead free boards?
K. S. G.
|
| Expert Panel Responses |
The ideal thickness is to be thick enough for good solderability, yet thin (flat) enough for part placement. Because of the HASL process and surface tension of solder, smaller pads will have a greater amount of solder as compared to larger pads. Due to this and coupled with lead free HASL having an inter-metallic two times that of leaded HASL a minimum thickness is more crucial in the lead free process than the tin/lead process. It is difficult to spec in a certain thickness because of the process so we (Florida Cirtech) concentrate on a minimum thickness and not on a range. Our recommended minimum thickness would be 100 microinches as this should insure good solderability.
Mike Scimeca
President, FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
|
|
|
