|
Sponsor
|
|
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
|
|
|
Sponsor
|
|
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
May 28, 2009 - Updated
May 26, 2009 - Originally Posted
Difference between shiny and matt solder resist
Are there differences in processing parameters and cost for shiny and matt solder resists in PCB manufacturing? Why does it seem that the shiny solder resist attracts more solder balls during wave soldering? Why do most PCB houses choose shiny solder resist as standard material?
T. S. Y.
|
| Expert Panel Responses |
Yes, there are process differences between the two types of mask although there isn't a difference in the price. The matte masks seems to have a harder time to wet as there is a roughened surface on the finish, thus the ball is less susceptible to stick. I I believe the glossy mask is a bit tougher so you have less of a tendency for the mask to scratch in process. In the market we mostly see a semi matte version which is a combination of the glossy and the matte masks.
Mike Scimeca
President, FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
|