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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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December 1, 2008 - Updated
December 1, 2008 - Originally Posted
PCB Cleaning After Long Term Storage
We need to assemble fine pitch PCBs that have been stored for 5 years. Is there a method for cleaning them to improve solderablity? The PCBs have hot air solder level with 63/37 solder finish. They are 4 layer .062 inches thick FR4 laminate.
C.H.
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| Expert Panel Responses |
63/37 HASL finish degrades with the growth over time of an intermetallic layer Cu6SN5. Usually the thickness of the HASL coating is enough to give good solderability for an extended period. If this intermetallic layer has broken through the surface then these boards will be difficult to solder. As for cleaning, this will help in removing any surface contaminants along with the oxide coating which will help but won't solve the solderability issue if again the intermetallic layer has grown to the surface. You can test this coating for solder and intermetallic thickness with a Sequential Electrochemical Reduction Analysis Instrument (SERA). Good luck.
Mike Scimeca
President, FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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