| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
|
|
| Ask the Experts |
|
|
December 10, 2007 - Updated
December 9, 2007 - Originally Posted
Impact of humidity on wave soldering process
How does a low humidity environment (<30%) affect the wave soldering process?
Is there any impact to the solder joints?
Oscar Jaquez
|
| Expert Panel Responses |
Low humidity is not a problem and is recommended to keep the humidity level down to 40% or less in a electronics manufacturing environment.
The problem is with higher humidity levels in that circuit boards will absorb higher levels of water and cause defects such as blow holes and even blistering of the PCB.
If you are keeping <30% humidity in your factory that is a good thing for manufacturing in wave soldering as well as SMT glue and solder past printing.
Greg Hueste
Senior Applications Engineer
Speedline Technologies
Greg joined Electrovert in February 1984. Based out of the Electrovert applications laboratory in Camdenton Missouri, Greg has been in the process applications support role since 2000. His primary responsibilities include providing process and machine applications support for the wave soldering lines as well as process, machine and operations training. He also provides applications support for the reflow and cleaner lines. Greg is a PBET certified trainer and holds two patents on wave solder nozzle design.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
|