Sponsor

Repair PCB Damage In-House
Get the tools and materials you need for reliable circuit board repair—from replacement pads and circuit tracks to plated-hole repair kits and epoxies.
Circuit Technology Center

Sponsor

Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation

Ask the Experts

December 10, 2007 - Updated
December 9, 2007 - Originally Posted

Impact of humidity on wave soldering process

How does a low humidity environment (<30%) affect the wave soldering process? Is there any impact to the solder joints?

Oscar Jaquez

Expert Panel Responses

Low humidity is not a problem and is recommended to keep the humidity level down to 40% or less in a electronics manufacturing environment. The problem is with higher humidity levels in that circuit boards will absorb higher levels of water and cause defects such as blow holes and even blistering of the PCB. If you are keeping <30% humidity in your factory that is a good thing for manufacturing in wave soldering as well as SMT glue and solder past printing.

Greg Hueste
Senior Applications Engineer, Speedline Technologies

Greg joined Electrovert in February 1984. Based out of the Electrovert applications laboratory in Camdenton Missouri, Greg has been in the process applications support role since 2000. His primary responsibilities include providing process and machine applications support for the wave soldering lines as well as process, machine and operations training. He also provides applications support for the reflow and cleaner lines. Greg is a PBET certified trainer and holds two patents on wave solder nozzle design.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN