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September 17, 2007 - Updated
September 17, 2007 - Originally Posted

Voids in Solder Balls

Is it possible that voids in solder balls can be carried over and stay in the connection during reflow?

T. P.

Expert Panel Responses

Typically solder voids will be formed during the reflow process. They are usually acceptable providing they do not exceed 25% of the ball volume and are not located at the ball/part interface or the ball/component interface. A large void in either of these locations can weaken during vibration, thermal or shock testing.

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Edward Zamborsky
Regional Sales Manager
OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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