July 30, 2007 - Updated
July 29, 2007 - Originally Posted
Wire stripping insulation prior to tinning
When using spring loaded wire strippers, is it the best practice to strip insulation and leave it on the end of the wire until it is ready for tinning? Thanks for your assistance.
P.M.
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This is all dependent upon the manufacturing cycle and the time span between the stripping operation and either the tinning or lugging operation. Leaving the insulation on the wire only protects the wire stray splay from being disturbed, which could cause birdcadging and similar types of problems. Leaving it on also creates another operation when the wire is to be either tinned or lugged, so that should be factored in the decision.
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
If the wire being stripped is multi strand - Yes. It will keep the wire structured prior to tinning and stop it fraying.
Allen W. Duck
CEO, ATEK llc
Allen Duck is a 20-year Electronics Industry veteran with Global experience in multiple fields of technology and management. He started A-Tek in 2006 to provide a sales and service channel for international equipment companies wishing to offer value based solutions to USA companies.
This is a good idea. Leaving the stripped end on the wire protects it from damage as it is moved around your facility.
Edward Zamborsky
Regional Sales Manager, OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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