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Scaling SMT Traceability
High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking.
Essegi Automation

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Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

Ask the Experts

May 29, 2006 - Updated
July 5, 2007 - Originally Posted

Difference between ENIG and Flash?

With PCB plating what's the difference between ENIG and Flash?

Mike Johnson

Expert Panel Responses

You are comparing apples to oranges. ENIG describes materials (nickel and gold) and processes (electroless for nickel and immersion for gold). Flash describes the plating thickness. Flash typically means a very thin (3 to 10 microinches) coating of gold, regardless of the process. Therefore, flash gold could be electrolytic, electroless, or immersion. Initial problems with flash gold in the 1990's tend to refer to an electroless process used over separable connectors that resulted in galvanic-driven pore corrosion.

Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions

Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.

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Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK