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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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November 5, 2006 - Updated
July 4, 2007 - Originally Posted
Is "Cost per placement" key factor
I've built a matrix for evaluating a new placement line. Should "Cost per Placement" be the key factor if all other specifications meet our needs?
D.G.
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| Expert Panel Responses |
Cost per placement is one factor, but total cost of ownership may be a better benchmark to use. Make sure all machines give you actual speeds for your test board, and give a money back guarantee that those speeds can be achieved. If you don't have a test board, use the IPC standard test board. Many suppliers have unfortunately returned to the days of grossly exaggerated "cycle rates". Be careful and make them all prove it.
Bob Black
North America Sales Manager, Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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