|
| Industry Paper |
UHDI Fabrication for IC Substrates: SAP and mSAP Processes
Approach described includes adhesion promotion, direct plating, electroless copper, blind-via filling, trench filling, and solder-resist metallization technologies. Precise control of surface preparation, activation, and copper thickness uniformity improves via coverage and interconnection without excessive roughening.
Uyemura International Corporation
|
|
Complete the form below to download this technical paper.
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
