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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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| Industry Paper |
The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
Kyzen Corporation
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Fastest 3D AOI in the Market
Experience the latest, fastest AOI on the market: the TR7700QH SII, an Ultra-High-Speed 3D AOI capable of up to 80 cm²/sec. Smart Factory Ready solution.
Test Research, Inc.
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