Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Viewpoint

March 2, 2026

VIEWPOINT 2026: Jesper Lykke, CEO, Viscom Inc.

Jesper Lykke, CEO, Viscom Inc.

In 2026, Viscom continued progress fueled by innovation, improving market conditions, and a strong project pipeline. A key milestone will be the launch of vAI Provision, a new software solution that underscores Viscom's expanding use of artificial intelligence to enhance our portfolio and deliver increased value to customers. AI is a core element of our product strategy, driving greater efficiency, performance, and differentiation in the marketplace.

While tariffs have presented challenges, overall trends indicate that conditions are improving. These external pressures appear to be easing, enabling customers to plan and invest with greater confidence moving forward.

The business outlook for 2026 is optimistic. Early indicators point to positive momentum, with the first three months of the year expected to be particularly important in validating this trend. Viscom enters the year with a robust list of projects already included in the forecast, reflecting healthy customer demand and strong market engagement.

Overall, the combination of new software launches, increased adoption of AI, a growing project pipeline, and improving market dynamics supports a positive outlook for 2026, with expectations of sustained growth and increased stability throughout the year.

Viscom looks forward to presenting new software and hardware innovations at APEX 2026. Stay tuned.

Jesper Lykke, CEO
Viscom Inc.
http://www.viscomusa.com

Viewpoint Index

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Achieve Reliable BGA Rework with Expert Reballing Methods
BGA reballing requires precision, process control, and proven techniques. Manufacturers improve rework quality and maximize BGA reliability with proven reballing practices.
Circuit Technology Center