circuitnet
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Plasma Etch
Sponsor
KYZEN
A Collaborative Model for Hands-On Electronics Manufacturing Education
KYZEN Corporation and the Rochester Institute of Technology (RIT) have established an academic-industry collaboration to integrate real-world electronics manufacturing challenges directly into engineering education.
KYZEN
Viewpoint
March 2, 2026

Jesper Lykke, CEO, Viscom Inc.

In 2026, we will be launching two important technology advancements. The first is a new member of our RD-500V rework soldering system family, designed to make alignment easier and more precise than ever before. Instead of manually aligning SMD components, alignment is now Automatic , with all axes motorized. This significantly improves usability, repeatability, and production efficiency.

In addition, we will introduce the UF-100 underfilled components desoldering system. The UF-100 is specifically developed to safely and reliably remove underfilled components, addressing one of the most challenging processes in advanced electronics rework and repair.

Tariffs have affected our business planning , however we are actively working to absorb costs internally so that our customers are not significantly impacted. Artificial Intelligence is a key focus for DEN-ON. We are investing heavily in AI to enable machine teaching, intelligent temperature control, and automated guidance for operators to create optimal one-shot soldering profiles.

Looking ahead to 2026, our strategy centers on machine learning and teaching technologies, allowing our systems to continuously learn and finely tune heat control algorithms for higher-quality, more reliable soldering results.
Jesper Lykke
CEO, Viscom Inc.
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Circuitnet Media LLC
Reflow Soldering Oven Survey
We invite you to participate in this important survey about Reflow Soldering Ovens. This survey is anonymous, and your personal data is not collected. Click to begin survey.
Circuitnet Media LLC
Peel-A-Way Removable Terminal Carriers