circuitnet
Sponsor
Circuit-Technology-Center

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center
AI-Technology-Inc
Viewpoint
February 25, 2026

VIEWPOINT 2026: Michail Klimkovic, CEO, XIMEA



VIEWPOINT 2026: Michail Klimkovic, CEO, XIMEA
Michail Klimkovic, CEO, XIMEA
The machine vision and imaging industry enters 2026 with both promise and complexity. Global supply chains have stabilized, yet geopolitical tensions and rising costs continue to challenge manufacturers. At XIMEA, we try to see these dynamics as a feature rather than a bug, attempting to find new ways to innovate our portfolio and strengthen partnerships.

In 2026, the family of ultra-high-resolution cameras welcomes into mass production the 245 Mpix model and new entries with Global shutter sensors. Expanding is also the offer of 3D vision through the use of ToF technology. All the new comers are exceptionally strong in XIMEA trademarks - the miniature form factor and highest speed possible.

Artificial Intelligence is no longer optional – it is all around, embedded in tools, processes, development and of course AI features. For AI to be effective the algorithms need high quality data and here is where top grade components used in XIMEA cameras serve especially well, further enhancing precision in automation.

The 2026 outlook for XIMEA is clear: find the best people for the task at hand, help them with properly integrated AI resources and combine it all with cutting-edge technology to achieve our core values in transparency, efficiency and innovation.

Michail Klimkovic, CEO
XIMEA
http://www.ximea.com
Viewpoint Index
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Alltemated

Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.