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Viewpoint

February 4, 2026

VIEWPOINT 2026: Doug Dixon, CEO, 360 BC Group Inc.

Translating Materials, Processes, and Performance Data into Impactful Technical Marketing

Doug Dixon, CEO, 360 BC Group Inc.

As we move into 2026, higher power density, and HDI designs are tightening thermal and reliability margins across electronic systems. Rising junction temperatures and finer features are pushing current materials to their limits, increasing the need for higher-performance TIMs, metalized IMS substrates, and advanced thermal dielectrics.

To help engineering teams address these challenges, 360 BC Group is expanding its library of award-winning technical papers that explain material behavior, process interactions, and real performance improvements. These papers, supported by test data, are paired with high-end graphics, and interactive visuals that make complex engineering concepts easy to understand.

Developed by Doug Dixon in 2017 to characterize solder paste performance, the SMTA test board has grown into an industry standard for evaluating SMT materials, print quality, and process capability. By collaborating with Shea Engineering, Universal Instruments, and RIT, we continue to use partner-generated data to validate assembly materials and processes, providing quantified insight into printability, stencil performance, flux behavior, CpK, and overall capability.

In 2026, 360 will keep helping engineering teams turn material science, process data, and reliability results into clear, credible technical narratives that support stronger design decisions and highlight true differentiation.

Doug Dixon, CEO
360 BC Group Inc.
http://www.360circuits.com

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