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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Ask the Experts Member

Joe Karcewski

Product Manager

APS-Novastar, LLC

Joe Karcewski has been a Process Engineer for 16 years in the industry. He is a certified IPC-A-610 trainer and is presently working at APS-Novastar as a Product Manager for Soldering Systems including Selective Soldering systems.

Joe Karcewski has submitted responses to the following questions.

Pin-in-Paste Hole Fill
To ensure proper plated hole fill during the screen printing process you must have the proper volume of solder paste. ...

Is PCB Baking Necessary?
This is a correct statement. PCB Baking is not necessary if the PCB is Vacuum Packed by the PCB Supplier ...

Recommended Rework Dwell Times
When hand soldering utilizing Sn/Pb solder, the maximum dwell time at any thru-hole lead should be 20 seconds. A much ...

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura