Eliminate Voids with Vacuum Reflow


Void elimination is essential today for high power / high heat dissipating products. Heller Vacuum Reflow ovens are the only systems that can deliver <1% void rate AT PRODUCTION VOLUMES.

This paper details the fine points of void reduction as well as eliminating solder splatter with controlled purge and refill. When equipped with a dual lane conveyor, DOUBLE UPH can be achieved—keeping up with high throughput demands of Consumer Electronics.


If you are attending the IPC APEX show in San Diego next week, stop by the Heller Industries booth #2137 to learn more.

Download technical paper on vacuum reflow technology

Download Paper

Additionally, for Semiconductor applications Heller has developed a technique for controlling warpage on wafer and substrates.
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