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White Paper Submission Guidelines
The daily Circuitnet e-mail newsletter and web site reaches over 300,000 industry professionals involved in electronics manufacturing and assembly.
If you have a technical white paper, post at no cost for readers to learn more about your technology.
White Paper Submit Form
Our readers are interested in technical solutions to the issues faced by electronics assembly industry professionals. White Papers should not promote the sale of a product or service.
Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better.
White Papers should be submitted as PDF files less than 2 Megs.
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A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped PoP
A novel epoxy flux EF-A was
developed with good compatibility with no-clean solder pastes, and imparts high
reliability for BGA assembly at a low cost. This compatibility with solder
pastes is achieved by a well-engineered miscibility between epoxy and no-clean
solder paste flux systems, and is further assured with the introduction of a
venting channel. Learn more in this white paper by Indium Corporation
Vice President of Technology, Dr. Ning-Cheng Lee. Find out more...
Indium Corporation
Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.
This page has been viewed 2194 times.
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