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White papers covering electronics manufacuring are posted in the order they are received. The most recent are at the top of the list.
Submit a White Paper
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Creep Corrosion on Lead-Free Printed Circuit Boards
The material and process changes required to eliminate lead from electronics as required by Restriction of Hazardous Substance ...
SMTA
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Manufacturing Steps Onto the Enterprise IT Stage
Today's manufacturing enterprises need a single, comprehensive business system for the manufacturing floor to complement existing ERP and ...
Aegis
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Stencil Design for Lead-Free SMT Assembly
In order to comply with RoHS and WEEE directives, many circuit assemblers are transitioning some or all of their soldering processes from tin-lead to lead-free within the upcoming year...
Alpha
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Taking the Brakes off Accelerators
Market growth in the HPC industry has been spurred by improvements to price/performance ratios brought about by clustering architectures and multi-core processors that leveraged the economies of scale in commodity hardware. However, the widespread adoption of both technologies has created computational inefficiencies and facilities challenges for many HPC applications...
Acceleware
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Beating the chip counterfeiters
As components increase in complexity their cost increases, with some specialist chips selling for many hundreds of dollars. The cost of these and many other IC's make counterfeiting them a potentially lucrative business and as always there will be people ready to make a "fast buck" at the expense of someone else.
Dage Precision Industries
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New Epoxy Flux Material Offers Underfill Protection
Though fluxing – or no-flow—underfills have been on the market for some time, the drawbacks of these older generation materials have prevented their widespread adoption. Challenges with performance and reliability often negate the in-line processing advantages of these materials.
Henkel
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A Feasibility Study of 01005 Chip Components
A study was performed to understand the assembly constraints of the newest miniaturized package chip components, 01005 (or 0402 metric). The study included all facets of surface mount assembly: pad design and ...
Alpha Metals
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Qualification of A Lead-Free Card Assembly & Test Process
Since 1999, many OEM firms and their contract manufacturing partners have been converting their product portfolios to comply with EU RoHS regulations. Significant investment has been made within the electronics industry for the development of new lead-free materials and assembly processes suitable for consumer electronics applications...
SMTA
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Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead-free wave soldering often requires the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases, the fluxes used in tin-lead soldering work well in lead-free assembly ...
Alpha
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Solder Paste Inspection Technologies - 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology Manufacturing Processes. In addition, transition to lead free solder paste and use of miniature components, has increased the complexity of the printing process. Read more ...
Speedline Technologies, Inc.
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