Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more. ECD
A simple alternative to conventional "golden board" profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.
ECD
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC Ormet® TLPS