Sponsor Ultrasonic Bonding: Cohesive connection between a chip & substrate Electrically conductive and mechanical bonds for temp-sensitive components or components that are difficult to heat with Ultrasonic Bonding. Tresky Automation

Sponsor A Hybrid PLP Technology Based On A 650 X 650 mm Platform Multiple fan-out wafers or subpanels are assembled on a carrier panel with reduced cost in the RDL process. Read more. Amkor Technology, Inc.