Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Sponsor Amkor's System in Package (SiP) Solutions Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more. Amkor Technology, Inc.