Sponsor Improve WLCSP Failure Analysis with Advanced 3D X-ray Microscopy Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL and Cu-pillar microbumps. Read more. ZEISS Microscopy

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group