Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Sponsor Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability. KYZEN