The low humidity could cause the solder paste to dry out prematurely, but your bigger concern with the low humidity is static control. Make sure your operators are using heel and wrist straps and testing them daily.
Edward Zamborsky
Regional Sales Manager, OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
Solder pastes react differently to temperature and humidity levels. Low humidity levels can exacerbate the driving off, or drying of solvents in solder pastes which in turn affect variables such as:- Response to pause (abandon time) how much time can pass between prints
- Overall stencil life - how long a solder paste remains useable before needing replenished/replaced
- Open/tack time - amount of time you have to place components
- Tack force - the pastes ability to hold components after placement
In reflow low humidity levels may produce signs of degraded wetting to component leads and/or spread to the PCB pads. Severe conditions may result in what appears to be un-reflowed solder. If you are using an older paste chemistry, work with your paste supplier and discuss your manufacturing conditions with them. Many pastes today have the ability to tolerate wider swings in temperature and humidity without compromising product reliability or changing the manufacturing process.
Mike Scimeca
President, FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
Rodney Miller
Capital Equipment Operations Manager, Specialty Coating Systems
Rodney is currently Operations manager at SCS coatings, Global Leader in Parylene and Liquid Coating equipment. Rodney applies his BS in Computer Integrated Manufacturing from Purdue University, along with 20+ years of Electronic manufacturing and Equipment Assembly, to direct the Equipment business at SCS Coatings. "We provide unique, value added coating equipment solutions for our customers". Including conformal, spin and Parylene coating expertise.
If your facility's ambient RH is only 16% then you are more prone to ESD (Electro Static Discharge) related defects. Humidity in the air helps to increase surface conductivity, which subsequently aids in dissipating electrostatic charges throughout your facility. ESD literature commonly recommends a MINIMUM RH of 40%, provided that this will not promote corrosion or delamination of the materials used in your products. For a MAXIMUM RH level I would never suggest going higher than 60% RH, for a variety of reasons including the impact of RH on Moisture Sensitive Devices. MSD floor life is dramatically reduced above 60% RH (Ref: Table 7-1 in IPC/Jedec J-STD-033B.1). The bottom line is that you want enough humidity to maintain ESD control, but not so much that you induce damage to MSDs. I would generally recommend 40% to 60% RH.
Mitch DeCaire
Sales Manager (Americas), Cogiscan, Inc.
Mitch DeCaire, Sales Manager at Cogiscan, has served the electronics manufacturing industry since 1989. His prior experiences include process engineering, business development, and engineering management roles with Nortel Networks, Vansco Electronics, Universal Instruments and Siemens.
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