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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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| Ask the Experts |
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April 16, 2007 - Updated
July 4, 2007 - Originally Posted
Jumper wire guidelines
We routinely add jumper wires to assembled circuit boards due to the nature of our product line. We need to attach them to all sorts of terminations. Does the IPC have clear guidelines for this? Are there any other resources?
D.B.
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| Expert Panel Responses |
There is an excellent guide on the Circuit Technology Center website. Visit the following pages for details: http://www.circuitrework.com/guides/6-1.html http://www.circuitrework.com/guides/6-3.html
Jeff Ferry
President, Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
There are a number of places where this type of information is available, IPC-A-610, section 4.1.3.2 for attachment to threaded fasteners, Section 6 for Terminals Connections, which includes various methods to attach and solder wires to different types of terminals. Section 11, Discrete Wiring, 11.2 Jumper wires attached to printed circuit boards and component, be it either leaded or leadless components. IPC 7711/7721 also discusses how to repair printed boards by adding, routing and soldering wires to boards and components.
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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