circuitnet
Sponsor
KYZEN
pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN
10028
Sponsor
SEHO Systems GmbH
Wave Soldering Processes Rethought
As a pioneer in the development of automated soldering technologies, SEHO is setting global standards today more than ever with outstanding features. Find out more.
SEHO Systems GmbH
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
April 16, 2007 - Updated
July 4, 2007 - Originally Posted

Jumper wire guidelines

We routinely add jumper wires to assembled circuit boards due to the nature of our product line. We need to attach them to all sorts of terminations. Does the IPC have clear guidelines for this? Are there any other resources?
D.B.
Expert Panel Responses
There is an excellent guide on the Circuit Technology Center website. Visit the following pages for details: http://www.circuitrework.com/guides/6-1.html http://www.circuitrework.com/guides/6-3.html

Jeff Ferry
Jeff Ferry
President, Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
There are a number of places where this type of information is available, IPC-A-610, section 4.1.3.2 for attachment to threaded fasteners, Section 6 for Terminals Connections, which includes various methods to attach and solder wires to different types of terminals. Section 11, Discrete Wiring, 11.2 Jumper wires attached to printed circuit boards and component, be it either leaded or leadless components. IPC 7711/7721 also discusses how to repair printed boards by adding, routing and soldering wires to boards and components.

Leo Lambert
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Test Research, Inc.
AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
Full-Rotation X-Ray Imaging