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Join E-tronix for an upcoming webinar series featuring sessions with 

KIC and LPMS. 


Learn how automatic thermal profiling is improving SMT process control through continuous, data-driven monitoring, and discover how low pressure molding can streamline encapsulation while improving protection, efficiency, and total cost of ownership in harsh environment applications.

   
     
   

Thursday, April 16th 

10:00 PT  I  12:00 CT  I  1:00 ET

   

Engineering Better Encapsulation: