Dear Colleague,
Are you ready to explore the next generation of high-reliability solder solutions? We're excited to highlight our innovative materials science technologies at APEX 2026 in Anaheim, California, March 17-19!
Experience The Next Revolution of Solder
Our team of technical experts will be on the show floor at Booth 1038, showcasing our cutting-edge solder solutions engineered to meet the demanding requirements of mission-critical applications:
Durafuse® HR Solder Alloy
A high-reliability solder paste mixed-alloy system featuring enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for automotive applications.
Durafuse® LT Solder Alloy
Reduces peak reflow temperatures and saves energy while providing superior drop shock and thermal cycling performance over conventional low-temp solders.
Indium12.9HF Solder Paste
A new halogen-free solder paste for fine feature printing with exceptional stencil print transfer efficiency.
CW-807RS Flux-Cored Wire
A high-reliability, halide-free flux-cored wire designed to enhance wetting speed and reduce cycle times, featuring industry-leading spatter control technology ideal for robotic soldering applications.
Indium8.9HF Series
This innovative solder paste series was engineered to provide consistent performance, high yields, and outstanding quality in every solder joint.
