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Optimize Your Soldering Process 

Learn from Industry Experts

   

Join KOKI’s expert-led 2025 webinar series and gain valuable insights into critical soldering challenges and solutions. Each session will explore key factors affecting solder joint reliability and provide practical strategies to enhance performance and efficiency.

     

Upcoming Webinars

   
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Solder Voiding – Causes and Remedies

Tuesday, April 22nd | 12:00 PM CDT
Speaker: Jerome McIntyre, Sales and Applications Engineer


Understand how solder voiding impacts reliability, strength, and thermal performance. Learn how to identify root causes and implement process optimizations to minimize void formation.

   
     
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Residue - Free Soldering Solution for Power Devices with Formic Acid Reflow

Thursday, May 29th | 12:00 PM CDT
Speaker: Shantanu Joshi, Head of Customer Solutions and Operational Excellence


Discover a cutting-edge, zero-flux residue solder paste designed for formic acid reflow, eliminating post-soldering cleaning while improving efficiency and sustainability.

     
   
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Enhancing Solder Joint Reliability Through Advanced Materials Development

Thursday, September 11th | 12:00 PM CDT
Speaker: Shantanu Joshi


Explore alternative solder alloys and KOKI’s proprietary crack-free flux paste designed for high-reliability applications.

     
   
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Understanding and Preventing Dewetting Defects in SMT Soldering

Thursday, November 20th | 12:00 PM CDT
Speaker: Shantanu Joshi


Gain practical knowledge on how to identify, troubleshoot, and prevent dewetting defects with insights from KOKI’s Defect Analysis Service.

     

Stay ahead in the ever-evolving world of soldering technology by joining KOKI’s expert-led webinars. Whether you're looking to optimize your soldering process, reduce defects, or explore cutting-edge materials, these sessions will provide the knowledge and strategies you need. 


Don’t miss this opportunity to gain valuable insights from industry leaders.

     

Download Our Latest Technical Paper

Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices

Originally presented at IPC APEX 2025

     

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