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Semiconductor package thermal characterization
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Thermal metrics, reliability to quality - Leveraging thermal transient test technology
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Understanding thermal performance and thermal reliability influences on semiconductor devices and IC packages is important during product development and across the electronics supply chain. This webinar discusses the fundamentals of applying thermal transient test technology for thermal characterization in 4 key areas:
- How to determine ic package thermal metrics
- Enhancing thermal simulation accuracy with calibration
- Thermal reliability studies: failure and lifetime insights
- Quality assessment to identify manufacturing defects
Watch this webinar for engineers in IC package thermal development, product management, reliability to manufacturing quality, or if you are focused on electronics hardware and systems mechanical design within thermal testing or simulation or reliability functions. |
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