Completely reimagined solder reflow process monitoring will change your productivity, your known good yield and your profitability.
ECD’s much-anticipated arrival of OvenSENTINEL™ is happening at IPC APEX EXPO 2020 and you’re invited. Learn what TrueProfile™ capability and real-time, comprehensive PCB oversight can bring to your business.
Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.
A simple alternative to conventional “golden board” profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.