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Viewpoint | ||
January 29, 2025
VIEWPOINT 2025: Chris Williams, Head of European Sales, Solderstar
Our Reflow Shuttle Verification Tool enables customers to manage reflow oven maintenance proactively. By monitoring parameters such as vibration in three axes, conveyor speed, nitrogen levels, vacuum, and temperature profiles, the tool helps identify process changes early. The addition of oxygen monitoring in parts per million (PPM) allows manufacturers to track nitrogen usage more precisely and ensure it is applied efficiently. This supports both reflow performance and environmental goals. In 2025, we expect automotive production to rebound, and Tier 1 EMS providers will increasingly prioritize environmental performance over cost savings. As nitrogen usage continues to be a major focus, Solderstar's tools will help manufacturers optimize nitrogen application, reduce wastage, and support ISO 14001 compliance—ensuring both quality and sustainability in PCB production. Chris Williams, Head of European Sales Solderstar http://www.solderstar.com |
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