We search for industry news, so you don't need to.
BGA Site Modification - Is It Possible?

This webcast reviews a common, but challenging, type of BGA site modification normally used for engineering changes and modifications when circuit routing changes are required.
Circuit Technology Center
Complete this form for immediate access to this webcast.

Your Name


Your E-mail


Your Company


Your State, or Country if outside USA



More Technical Papers and Webcasts
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
Periodic Pulse Plating of Mid-Aspect Ratio PCB's for Enhanced Productivity
How solder ball technology can facilitate QFP device transition
Overcoming Tombstones and Opens Due to Thermal Inequalities
Economic Order Quantity (EOQ) in Electronics Contract Manufacturing
Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications
Selective Soldering Solutions for High Thermal Mass & Fine-Pitch Components
A Novel ENIG Surface Finish for Robust Solder Joints
Improve Performance & Reliability of LED Systems With Protection Materials
Differences Between Through-Hole and Surface-Mount