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Jul 6, 2018
New Technique to Create sub 2.0 µm Interconnects on Panel Format
Panel level packaging for high-density interconnects can be achieved with the combination of a nozzle-less spray technology and next generation advanced packaging ...
Ultrasonic Systems, Inc.
Jun 20, 2018
Package Thermal Challenges Due to Changing Mobile System Form Factors
This white paper investigates the historical evolution of mobile platforms and their impact on packaging thermal challenges. Metrics for evaluating the optimization ...
Amkor Technology, Inc.
Jun 18, 2018
Metal-Oxide (MOX) Gas Sensor Testing
The adoption of MEMS technology for MOX gas sensors resulted in reduced manufacturing costs. This paper discusses a creative test solution that matched the overall ...
Marvin Test
Jun 7, 2018
The Science of Bond Testing
With most products consisting of thousands of interconnects bond testing is an essential tool. The Science of Bond Testing is a method for designing the best method ...
XYZTEC
May 8, 2018
IC Socket- Carrier for Semiconductor Devices in Finished Product
A socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect ...
Ironwood Electronics
Apr 24, 2018
Multi-Die Packaging and Thermal Superposition Modeling
Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets.
Amkor Technology, Inc.
Apr 16, 2018
Reducing the Cost of Applying Package-Level EMI Shield Coatings
A substantial reduction in process cost (up to 60%) can be achieved by using ultra-Thin Coating Application Technology to apply sprayable high-performance coatings in a less than ...
Ultrasonic Systems, Inc.
Mar 26, 2018
Plating and Film Adhesion Testing Technique
The bond quality of plating and films is essential for product reliability but not so easily measured. Conventional scratch testing is a proven method but both ...
XYZTEC
Feb 26, 2018
Eutectic Bonding -- Successful Applications
The choice of eutectic bonding is determined by the application and the technical requirements. For example, for aerospace and photonic applications, eutectic ...
MRSI Systems
Feb 5, 2018
BGA Socket with Heatsink for High Power Devices
The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit board with as little electrical load as possible ...
Ironwood Electronics