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Oct 25, 2018
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
Article describes a process for the uniform deposition of electroless nickel on sputtered or vapor deposited aluminum pads in various crystal orientations, and, secondarily ...
Sep 20, 2018
Multichip Integrated Copper Clip Package Technology
Copper clip enables MOSFET packages to address: lower resistance, higher power and frequency switching requirements. Advancements integrated multichip solutions like ...
UTAC Group
Sep 14, 2018
IC Socket Footprint -- Why is it important?
An IC socket can be defined as an electromechanical device, which provides a removableinterface between the IC package and the system circuit board with minimal effect ...
Ironwood Electronics
Sep 11, 2018
Surface Mount Guidelines for Amkor's DRMLF®
This app note provides guidelines for SMT assembly of Amkor's DRMLF® packages using prevalent practices in the SMT industry and standards such as IPC and JEDEC.
Amkor Technology, Inc.
Jul 31, 2018
Lasers for High-speed Sample Preparation
Microstructure diagnostics and failure analysis are key to improving electronics manufacturing. New developments in laser micromachining enable the use of lasers in ...
3D-Micromac AG
Jul 26, 2018
Developing a Theta jc Standard for Electronic Packages
This paper presents some of the considerations used to develop a steady-state testing method for measuring the junction-to-case thermal resistant in electronic packages.
Amkor Technology, Inc.
Jul 20, 2018
Is Fully Automatic Bond Testing Possible?
Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is possible with a modern bond ...
Jul 6, 2018
New Technique to Create sub 2.0 µm Interconnects on Panel Format
Panel level packaging for high-density interconnects can be achieved with the combination of a nozzle-less spray technology and next generation advanced packaging ...
Ultrasonic Systems, Inc.
Jun 20, 2018
Package Thermal Challenges Due to Changing Mobile System Form Factors
This white paper investigates the historical evolution of mobile platforms and their impact on packaging thermal challenges. Metrics for evaluating the optimization ...
Amkor Technology, Inc.
Jun 18, 2018
Metal-Oxide (MOX) Gas Sensor Testing
The adoption of MEMS technology for MOX gas sensors resulted in reduced manufacturing costs. This paper discusses a creative test solution that matched the overall ...
Marvin Test