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Jan 15, 2019
Gold Planar Bumps for Flip Chip Bonding with Challenging Applications
Achieving consistent, quality Au Planar bumps has been a challenge that the industry has been trying to meet for years. This case study explore these difficult ...
Palomar Technologies
Jan 7, 2019
Sequential Infiltration Synthesis: A New Lithographic Enhancement Method
U.S. national laboratory researchers have found that the many demands associated with the "resist" can be met by the use of a technique known as sequential infiltration ...
Argonne National Laboratory
Dec 6, 2018
Achieving Low Voiding for Power Devices
For power device applications where low void concentration & reduced costs are important, learn how the solder paste solution, with different pressures results in ...
Palomar Technologies Inc.
Nov 26, 2018
Socket Cleaning on Handlers without Auto-Clean Functions
In-line preventative or on-demand, contactor cleaning execution extends socket lifetime, improves test cell uptime, and increases yield. For older handlers, it is possible ...
International Test Solutions
Nov 15, 2018
Active Optical Cable Transceiver Packaging Trends
EEL and VCSEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments.
Palomar Technologies Inc.
Oct 25, 2018
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
Article describes a process for the uniform deposition of electroless nickel on sputtered or vapor deposited aluminum pads in various crystal orientations, and, secondarily ...
Uyemura
Sep 20, 2018
Multichip Integrated Copper Clip Package Technology
Copper clip enables MOSFET packages to address: lower resistance, higher power and frequency switching requirements. Advancements integrated multichip solutions like ...
UTAC Group
Sep 14, 2018
IC Socket Footprint -- Why is it important?
An IC socket can be defined as an electromechanical device, which provides a removableinterface between the IC package and the system circuit board with minimal effect ...
Ironwood Electronics
Sep 11, 2018
Surface Mount Guidelines for Amkor's DRMLF®
This app note provides guidelines for SMT assembly of Amkor's DRMLF® packages using prevalent practices in the SMT industry and standards such as IPC and JEDEC.
Amkor Technology, Inc.
Jul 31, 2018
Lasers for High-speed Sample Preparation
Microstructure diagnostics and failure analysis are key to improving electronics manufacturing. New developments in laser micromachining enable the use of lasers in ...
3D-Micromac AG