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Dec 6, 2018
Achieving Low Voiding for Power Devices
For power device applications where low void concentration & reduced costs are important, learn how the solder paste solution, with different pressures results in ...
Palomar Technologies Inc.
Nov 26, 2018
Socket Cleaning on Handlers without Auto-Clean Functions
In-line preventative or on-demand, contactor cleaning execution extends socket lifetime, improves test cell uptime, and increases yield. For older handlers, it is possible to develop a "pseudo on-line" cleaning process.
International Test Solutions
Nov 15, 2018
Active Optical Cable Transceiver Packaging Trends
EEL and VCSEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments.
Palomar Technologies Inc.
Oct 25, 2018
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
Article describes a process for the uniform deposition of electroless nickel on sputtered or vapor deposited aluminum pads in various crystal orientations, and, secondarily ...
Sep 20, 2018
Multichip Integrated Copper Clip Package Technology
Copper clip enables MOSFET packages to address: lower resistance, higher power and frequency switching requirements. Advancements integrated multichip solutions like ...
UTAC Group
Sep 14, 2018
IC Socket Footprint -- Why is it important?
An IC socket can be defined as an electromechanical device, which provides a removableinterface between the IC package and the system circuit board with minimal effect ...
Ironwood Electronics
Sep 11, 2018
Surface Mount Guidelines for Amkor's DRMLF®
This app note provides guidelines for SMT assembly of Amkor's DRMLF® packages using prevalent practices in the SMT industry and standards such as IPC and JEDEC.
Amkor Technology, Inc.
Jul 31, 2018
Lasers for High-speed Sample Preparation
Microstructure diagnostics and failure analysis are key to improving electronics manufacturing. New developments in laser micromachining enable the use of lasers in ...
3D-Micromac AG
Jul 26, 2018
Developing a Theta jc Standard for Electronic Packages
This paper presents some of the considerations used to develop a steady-state testing method for measuring the junction-to-case thermal resistant in electronic packages.
Amkor Technology, Inc.
Jul 20, 2018
Is Fully Automatic Bond Testing Possible?
Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is possible with a modern bond ...