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May 8, 2018
IC Socket- Carrier for Semiconductor Devices in Finished Product
A socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect ...
Ironwood Electronics
Apr 24, 2018
Multi-Die Packaging and Thermal Superposition Modeling
Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets.
Amkor Technology, Inc.
Apr 16, 2018
Reducing the Cost of Applying Package-Level EMI Shield Coatings
A substantial reduction in process cost (up to 60%) can be achieved by using ultra-Thin Coating Application Technology to apply sprayable high-performance coatings in a less than ...
Ultrasonic Systems, Inc.
Mar 26, 2018
Plating and Film Adhesion Testing Technique
The bond quality of plating and films is essential for product reliability but not so easily measured. Conventional scratch testing is a proven method but both ...
XYZTEC
Feb 26, 2018
Eutectic Bonding -- Successful Applications
The choice of eutectic bonding is determined by the application and the technical requirements. For example, for aerospace and photonic applications, eutectic ...
MRSI Systems
Feb 5, 2018
BGA Socket with Heatsink for High Power Devices
The classic function of a socket is to provide a connection mechanism from the IC (Integrated Circuit) to the circuit board with as little electrical load as possible ...
Ironwood Electronics
Dec 21, 2017
Hermetic Sealing Longer Package Perimeters
Low Impedance welding technology provides "one shot" hermetic sealing of larger electronic packages and feedthroughs that formerly required massive capital investment and delivered questionable quality.
Hermetric, Inc.
Nov 20, 2017
EMI Protection at the Package Level
Miniaturization and SiP advances are driving a need for more effective EMI shielding at the package level. Two new approaches from Henkel are providing unique ...
Henkel Electronics Materials, LLC
Oct 26, 2017
TLS-Dicing: A Novel Laser-based Dicing Approach for Silicon Carbide Power Devices
This paper shows the potential of TLS-Dicing for SiC-based power devices. Separation by using TLS-Dicing results in a high yield count in combination with very high edge ...
3D-Micromac AG
Oct 13, 2017
Dam and Fill Encapsulants Continue To Protect Sensitive Packages
For over twenty years NAMICS dam and fill encapsulants have protected fragile integrated circuits and wire bonds. Newly developed EU SVHC-free grades are now available.
NAMICS Technologies, Inc.