We search for industry news, so you don't need to.
White Papers Index arrow   Page 1 of 43   arrow

Submit a White Paper
Jun 23, 2017
Low Temperature Shock Resistance Solder
As handheld devices become increasingly smaller and complex, there is a shift in reliability requirements of solder pastes. Use of low temperature alloys results ...
Alpha Assembly Solutions
Jun 7, 2017
Addressing 3D Automated Optical Inspection Challenges
3D Automated Optical Inspection, using multi-view 3D sensors and parallel projection captures more of the board, then uses sophisticated fusing algorithms for one precise 3D image.
CyberOptics Corporation
Jun 1, 2017
Four Solder Pastes, One Performance Leader
In a recent independent study, four industry solder pastes were evaluated to assess printing and process performance. Results indicated one clear leader, formulated with ...
Henkel Electronics Materials, LLC
May 30, 2017
The next generation of smartphone casings
The trend in smartphones is moving away from aluminum enclosures to glass or ceramic bodies with metal frames made from materials with higher mechanical strength ...
DSM
May 2, 2017
Risk Mitigation in Hand Soldering
Failed solder joints are a constant source of PCB failure, hand soldering depends on the control of variables into the process. The highest point of risk during this process ...
Metcal
Apr 24, 2017
Vapor phase reflow's effects on surface insulation resistance
Surface insulation resistance (SIR) is a critical property for reliable assemblies using no-clean SMT process. Studies show that the reflow profile and atmosphere used can have ...
Alpha Assembly Solutions
Apr 14, 2017
Silicones for Circuit Board Conformal Coating
Despite the higher gas permeability of silicone relative to other polymers, coatings formulation design approaches and adhesion improvements can allow mitigation of gas ...
Momentive Performance Materials Inc.
Mar 28, 2017
The enabling technology for Industry 4.0 and IoT
Connectivity between different machines, devices and enterprise systems is the main hurdle to achieve Industry 4.0 in the electronics assembly. Cogiscan provides ...
Cogiscan Inc.
Feb 13, 2017
Solder & Fluxes for High Rel Automotive
The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties for Tier 1 automotive suppliers.
Alpha Assembly Solutions
Feb 10, 2017
Elimination of Mid-Chip Solder Balls
Find out what aperture design and highly-capable solder paste can do to get rid of mid-chip solder balls, a defect seen most frequently with chip resistors, but one that ...
Henkel Electronics Materials, LLC