White Papers    Page 1 of 13

White papers covering electronics manufacuring are posted in the order they are received. The most recent are at the top of the list. Submit a White Paper

Posted: Feb 1, 2012 RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies Explore the die and wire bonding requirements of several device cases in RF, Microwave, High Brightness LED, and Optoelectronic package formats when ... Palomar Technologies

Posted: Jan 24, 2012 Solder Fortification™ with Preforms The use of solder preforms in "solder starved" applications can provide enough solder paste to form a quality solder joint. Find out more... Indium Corporation

Posted: Jan 19, 2012 Signal Integrity Simulation for High Speed Sockets High-speed sockets continue to perform important functions for today’s IC component and electronics engineers. In the area of electrical ... Ironwood Electronics

Posted: Jan 10, 2012 Enabling Thinner Packages through Novel Materials Innovations New developments in semiconductor packaging materials are enabling continued miniaturization of modern electronics processes. Advances in die attach ... Henkel Electronics

Posted: Dec 19, 2011 How to Deal with Resonances in Wirebonding Resonance effects can impede or prevent wire bond formation. The major kinds of resonance are discussed: sharp resonances on eigenfrequencies and ... F & K Delvotec

Posted: Dec 6, 2011 Temporary Bonding and Release to Enable Through-Silicon Interconnects Several process flows have been proposed for the use of temporary carriers. This paper discusses three options for bonding and debonding. Brewer Science, Inc.

Posted: Dec 1, 2011 FC300R High Accuracy Bonder with Robotics Ideal for high accuracy C2W bonding for 3D integration, the FC300R features Face-to-Back or Face-to-face Alignment (flip-chip). The system, with high ... SET - Smart Equipment Technology

Posted: Nov 28, 2011 Flip-Chip Interconnection Integrity Testing Solutions This application note describes interconnection reliability problems, provides the flip-chip solution overview, and includes test application ... Ridgetop Group, Inc.

Posted: Nov 17, 2011 Jetting High Thermal Conductivity Epoxy Bondline thickness repeatability is essential when working with die attach. Thus volume dispense repeatability over production becomes a ... Diemat, Inc.

Posted: Nov 9, 2011 Process & Equipment Enhancements for C2W Bonding This paper reviews three major areas of process or equipment development: bonding throughput enhancement, the removal and prevention of surface ... Smart Equipment Technology