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Ask the Experts    Page 1 of 78  
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February 8, 2010
Leadless Component Hand Soldering Help
We are seeing an increase in the use of leadless components on our assemblies, including many 20 lead ceramic ...
Responses by:
  • Bill Coleman, Vice President Technology, Photo Stencil
  • Steven Adamson, Market Manager, Nordson Asymtek
  • Stephanie Henninger, Director, Integrated Ideas & Technologies, Inc.
February 3, 2010
Long Term Concerns with Disturbed Solder Joints
What are the short term and long term defects that may result from a disturbed solder joint? I know that multiple ...
Responses by:
  • Rodney Miller, VP of Manufacturing, Tri-onics Inc
  • Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
  • Don Naugler, General Manager, VJ Technologies, Inc.
February 1, 2010
BGA Shifting During Reflow
We have a BGA component that is shifting during inline reflow. The BGA is shifting enough to cause some open joints. The BGA component ...
Responses by:
  • Sandip Thakor, Quality Engineer, Matrix Telecom Solution P Ltd
  • Edward Zamborsky, Regional Sales Manager, OK International Inc.
  • Steven Adamson, Market Manager, Nordson Asymtek
  • Stephanie Henninger, Director, Integrated Ideas & Technologies, Inc.
  • Al Cabral, Product Development Manager, VJ Technologies, Inc.
January 27, 2010
What Is the Life Span for a Profile Board?
How many times can I use one test board to profile our reflow oven before throwing it away, and why?
Responses by:
  • Mark Waterman, Engineer / Trainer, Electronic Controls Design, Inc. (ECD)
  • Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
  • Al Cabral, Product Development Manager, VJ Technologies, Inc.
  • Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
  • Brian O'Leary, Sales Manager, KIC
January 25, 2010
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. You can see images of the contamination. Do you have any ideas ...
Responses by:
  • Dr. Craig D. Hillman, CEO & Managing Partner, DfR Solutions
  • Mike Bixenman, CTO, Kyzen Corp.
  • Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
  • Karthik Vijayamadhavan, Area Manager - West Coast, Indium Corp.
  • Tim Jensen, Product Manager, Advanced Assembly Materials, Indium Corp.
  • Terry Munson, President/Senior Technical Consultant, Foresite
  • Daniel (Baer) Feinberg, Vice President, Fein-Line Associates
  • Tom Forsythe, Vice President, Kyzen Corporation
  • Jim Williams, VP, CTO, Polyonics, Inc.
Ask the Experts    Page 1 of 78  

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