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August 18, 2008
Voids in leadless packages
What is the primary cause of solder voiding in regards to leadless packages such as BGA's?
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August 18, 2008
What is the correct coupon for moister and insulation test?
I have a question about moisture and insulation resistance test. Why do some test methods (IPC-TM-650) identify the use of ...
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August 11, 2008
Wave Soldering Problems
In our Printed Circuit Assembly production line, we are seeing many process defects occur after wave soldering operations. The defects ...
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August 11, 2008
Through Hole Soldering on 24 Layer Board
We are assembling a back plane board with 24 layers. We are attempting to hand solder solder through-hole components, but are ...
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August 4, 2008
Recover Solder from Dross
Does it make economic sense to develop an in-house capability for recovering pure solder from solder dross? What are ...
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August 4, 2008
Reflow BGA's with CSP's
We are trying to reflow a PCB that contains both BGA and CSP's. During reflow we are seeing solder being sucked into ...
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July 28, 2008
Wetting Problem SAC finished component
We are having solder wetting problems on a component with leads that are finished with SAC solder, using SnPb solder paste specified ...
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July 28, 2008
Procedure for handling moisture sensitive PCB's
IPC-JEDEC J-STD 0020B provides guidance concerning handling and packaging of moisture sensitive devices. PCBs are also moisture ...
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July 21, 2008
Clean a no clean PCBA
How do I remove flux residue and white residue from a no clean PCBA? Once this has been done are their any ...
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July 21, 2008
BGA Rework
When it comes to BGA rework, where the solder paste gets applied "manually" using a Mini-Stencil, how much sense does it make to ...
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