March 10, 2010 Re-plating lead-free components for tin/lead assembly We work with an aerospace manufacturer on a PCB assembly that includes Pb-free components (no BGAs). The device is ... Responses by:
• Steven Adamson, Market Manager, Nordson Asymtek
• Chris Palin, European Manager, HumiSeal
• Terry Munson, President/Senior Technical Consultant, Foresite
• Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
March 8, 2010 Contamination Prior to Conformal Coating When moving PCB assemblies through the factory we use a tray that is not made of anti-static material. In order to minimize ... Responses by:
• Chris Palin, European Manager, HumiSeal
• Hartmut Berndt, President, B.E.STAT group
• Steven Adamson, Market Manager, Nordson Asymtek
• Edward Zamborsky, Regional Sales Manager, OK International Inc.
• Phil Kinner, Business Director, HumiSeal / Chase Electronic Coatings
• Ken Bliss, President & CEO, Bliss Industries, Inc.
• Jim Williams, VP, CTO, Polyonics, Inc.
• Harold Hyman, Consultant, VJ Electronix
March 3, 2010 When Should We Use Underfill? We have a circuit board assembly with a wafer level chip scale package. The package is 2mm x 2mm with 20 solder ... Responses by:
• Scott D. Szymanski, Global Marketing Manager, March Plasma Systems
• Steven Adamson, Market Manager, Nordson Asymtek
March 1, 2010 Is Baking Required After Aqueous Cleaning? Do assembled circuit board assemblies need to be baked after routine aqueous cleaning? If so how long ... Responses by:
• Edward Zamborsky, Regional Sales Manager, OK International Inc.
• Tom Forsythe, Vice President, Kyzen Corporation
• Leo Lambert, Vice President, Technical Director, EPTAC Corporation
• Mike Konrad, President, Aqueous Technologies
• Umut Tosun, Application Technology Manager, Zestron America
February 24, 2010 Lead Free Percentage Can anyone offer an estimate on the percentage of non-military circuit board assemblies now ... Responses by:
• Bob Black, President and CEO, Juki Corporation
