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| Industry Press |
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September 25, 2017
Dr. Jennie Hwang to address Package/Board Level Integrity at IMAPS Dr. Jennie Hwang to address Package/Board Level Integrity & Solder Joint Reliability at the IMAPS 50th Anniversary Symposium on October 9. Monday, October 9, Dr Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge to address "Package/Board Level Integrity & Solder Joint Reliability." With the goal to produce reliable products while achieving high yield production, this short course provides a holistic overview of product reliability and of critical players of the package/board level integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Recent developments related to lead-free solder materials and the prevention of PCB laminates issues, tin whisker and intermetallics-related concerns in relation to manufacturability and reliability will be outlined. The short course emphasizes on practical, working knowledge, yet balanced and substantiated by science. Attendees are encouraged to bring their own selected systems for deliberation. Registration: http://www.imaps.org/imaps2017/pdcs.htm#d3 PDC D3: Package/Board Level Integrity & Solder Joint Reliability 1:00 - 3:00PM Topics Covered 1. Package/board level integrity -- premise 2. Package/board level integrity and solder joint reliability -- materials, manufacturability 3. Solder alloys -- what is the performance record of SAC alloy vs. metallurgical principles? 4. Solder joint materials -- what are on the horizon? 5. Solder joint thermo-mechanical behavior and degradation 6. Solder joint failures modes -- interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced 7. Solder joint failure mechanisms -- ductile, brittle, ductile-brittle transition fracture 8. Solder joint strengthening metallurgy to increase fatigue and creep resistance 9. Distinctions and commonalities between Pb-free and SnPb solder joints 10. Thermal cycling conditions - effects on test results, test results interpretation 11. Intermetallics -- Pb-free vs. SnPb, at-interface, in-bulk 12. Tin whisker -- factors, the ranking of mitigating measures 13. Life-prediction model -- parameters to be considered 14. Best practices and ultimate reliability H-Technologies Group April 23, 2024 AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Juarez AIM Solder is pleased to announce its participation in the upcoming SMTA Juarez Expo & Tech Forum taking place .... April 23, 2024 KYZEN to Focus on AQUANOX A4618 at SMTA Wisconsin Expo & Tech Forum KYZEN will exhibit at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 7, 2024 at the Four Poins ... April 23, 2024 Murray Percival Company Highlights Advanced Depanelizers The Murray Percival Company is currently highlighting Murray Percival Depanelizers from its comprehensive product ... April 23, 2024 ZESTRON Academy Introduces Cutting-Edge SMT Webinar Series for 2024 ZESTRON is thrilled to announce the launch of its newest webinar series as part of ZESTRON Academy, focusing on Surface Mount ... April 23, 2024 New Flying Prober Simplifies Testing of Complex PCB Assemblies at DESY Electronics manufacturers at DESY are utilizing the GRS550 flying prober from Polar Instruments to ensure the quality ... April 23, 2024 TTM Technologies, Inc. Acquires Inovaxe's SREX Racks from APEX Show Floor Inovaxe is thrilled to announce that TTM Technologies, Inc. has purchased its cutting-edge SREX Racks directly off the show ... April 22, 2024 AIM Solder's Dillon Zhu Presents Ultraminiature Soldering @ SMTA China East AIM Solder is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, ... April 22, 2024 ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024! ViTrox is pleased to announce its participation in the NEPCON China 2024 at Booth #1H27 at Shanghai World Expo Exhibition ... April 22, 2024 ROCKA to Showcase Expanded Services & Top Brands at Three SMTA Expos in May ROCKA Solutions is gearing up to exhibit at three SMTA Expos in May. With a strategic focus on growth and expansion, ... April 22, 2024 Bosch relies on DELO adhesives for mild-hybrid system 48-volt batteries can reduce vehicle carbon emissions by up to 15 percent. Bosch is known as the technology leader ... |
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