August 14, 2012

Assembléon's quality and flexibility at NEPCON

Assembléon's booth at NEPCON South China (Shenzhen, booth 1G50, August 28 – 30) will be dedicated to the perfect combination of quality and flexibility, showing the iFlex and AX-501 Hybrid.

Assembléon's A-Series are well known for their high reliable placement quality. The same unique single-pick/single-place technology is used for iFlex, Assembléon's answer to the markets changing requirements. iFlex produces the highest board quality, giving the industry's highest First Pass Yield production levels with defect levels of less than 1 DPM.

The A-Series' flexibility lies in the single type of head, which can place a wide range of components, and the output of machine which is easily configurable. iFlex takes the term flexibility to a whole new level; it guarantees fast flexible setups and changeovers, allowing the industry to meet its clients changing demands such as smaller batch sizes, product variety and just in time deliveries. Moreover, iFlex has been designed for highest throughput. It increases productivity in high product mix environments by more than 30%.

Assembléon will also show its technologically advanced AX-501 Hybrid. This cost-effective solution, an offspring of Assembléon's A-Series flagship, combines high speed and high accuracy for back-end and embedded applications. AX-501 Hybrid has proven itself a valuable asset to Assembléon's portfolio.

Assembléon is looking forward to welcoming the Asian SMT industry at NEPCON South China in Shenzhen.

For more information visit http://www.assembleon.com

Preview the IPC Outlook listing for Assembléon

Additional News From Assembléon
October 12, 2012
Introduction of Western Regional Sales Manager for Assembléon
Assembleon is pleased to announce the appointment of Tom Tallcott as Western Regional Sales Manager. Tom will be responsible for the region ...
September 20, 2012
Assembleon chairs Consortium working on issues facing equipment assemblers
An informal industry Consortium is collaborating on a common approach to whole-line electronic equipment assembly. A two-day industry seminar chaired by Assembléon on ...
August 21, 2012
Assembleon Introduces Wafer Handling for Flip-Chip Bonder
Assembléon is adding wafer feeding to its A-Series Hybrid at this year's Semicon Taiwan. The new DDF Innova Direct Die Feeder converts Assembléon's pick & place ...
August 14, 2012
Assembléon's quality and flexibility at NEPCON
Assembléon's booth at NEPCON South China (Shenzhen, booth 1G50, August 28 – 30) will be dedicated to the perfect combination of quality and flexibility, showing the iFlex and ...
April 27, 2012
Assembleon Welcomes New CEO
Exactly one year after the privatization from Royal Philips, the management of Assembléon is transferred to a new CEO and management team, fully composed of people ...

News By Circuitnet