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December 19, 2014
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Nihon Superior's Keith Sweatman to Present at TMS Annual Conference

Feb 17, 2012 - OSAKA, JAPAN -- Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that its Senior Technical Advisor Keith Sweatman will present "The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders" at the upcoming TMS Annual Conference, scheduled to take place March 11-15, 2012 at Walt Disney World Swan and Dolphin Resort in Florida. The presentation will take place during the session, titled "Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications" on Wednesday, March 14, 2012 at 10:15 a.m.

The intermetallic compound layer that forms at the interface between a solder and the substrate is generally regarded as an important part of the joint that can affect its reliability in service. The nature of the intermetallic and, most importantly, the rate at which it grows at the elevated temperatures to which a joint may be subjected in service, varies with the alloy. In this paper, the authors report the results of study of the formation and growth of the intermetallic layer formed by eight alloys that are representative of solders currently in use or under consideration. These results could provide a guide to the selection of lead-free solders for particular applications.
Nihon Superior Co. Ltd.
For more information visit http://www.nihonsuperior.co.jp/english
Additional News From Nihon Superior Co. Ltd.
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Keith Sweatman Co-Authors Paper for SMTAI Technical Sessions
Nihon Superior Co. Ltd. announces that Keith Sweatman will present the paper titled "Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders ...
August 27, 2014
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Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont ...
June 20, 2014
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May 8, 2014
Nihon Superior Thanks SN100C Licensees and Partners
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Nihon Superior's New General Purpose Solder Wire Wins a 2014 NPI Award
Nihon Superior Co. Ltd. announces that it has been awarded a 2014 NPI Award in the category of Cored Wire for its SN100C (031) Lead-free Flux-Cored Solder Wire. The ...
February 21, 2014
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Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17 ...
October 14, 2013
Nihon Superior to Sponsor FIRST(R) Robotics Competition at SMTAI
Nihon Superior Co. Ltd. will sponsor the FIRST Robotics competition at the upcoming SMTA International Exhibition, scheduled to take place October ...
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Nihon Superior to Showcase SN100C Lead-free Solder Alloy at Productronica
Nihon Superior Co. Ltd. will exhibit in Hall A4, Stand 451 with Balver Zinn Josef Jost GmbH & Co. KG at the Productronica International Trade Fair ...
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Nihon Superior's Keith Sweatman to Introduce Novel Lead-Free Alloy at SMTAI
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place ...
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