|
|
|
|
| Industry Press |
February 18, 2021
Circuit Technology Center Expands In-House Component Testing ServicesCircuit Technology Center has recently purchased and commissioned an SCS Ionograph BTSP series ionic cleanliness test system to support cleanliness testing of electronic components. Cleanliness testing of components is often required by defense base customers after the components have been processed through lead free to leaded solder alloy exchange. In addition to cleanliness testing, Circuit Technology Center also supports XRF, X-ray, SAM, Solderability and BGA ball shear testing services. More information about Circuit Technology Center's component modification services and testing services can be found at: https://www.circuitrework.com/services/tinning.html ########## Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world. For more information, please visit: www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com. Circuit Technology Center More Information November 14, 2023 Circuit Technology Center Announces New Component Trim and Form Service Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. ... October 10, 2023 New Technical Paper Unveils Key Strategies for Successful BGA Rework Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new paper offers valuable ... July 14, 2023 Whitepaper Discusses Critical Process Steps for BGA Device Re-balling The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker ... June 8, 2023 CircuitMedic Unveils the Ultimate Tool Set for Electronics Techs CircuitMedic has assembled the ultimate benchtop tool set for serious electronics technicians and professionals. This curated selection of nine finely-crafted tools ... March 28, 2023 Circuit Technology Center Announces Series of CircuitMedic Circuit Frames Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit patterns, lands, SMT ... March 1, 2023 White Paper: Considerations for Electronic Component Tin Whisker Mitigation The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing ... January 19, 2023 Circuit Technology Center At IPC-APEX Expo Booth #2936 Visitors to this year's IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, are invited to stop by booth #2936 to learn ... November 2, 2022 New White Paper Examines Key Steps to Component Lead Tinning The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing ... September 29, 2022 Circuit Technology Center Expands BGA Re-balling Capacity Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new machine doubles the existing ... August 9, 2022 Technical Paper Details Essential Practices for Gold Mitigation Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement concerns. The ideal method ... |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|