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April 18, 2018
Int'l Conference for Electronics Enabling Technologies Program Finalized Markham, ON, Canada - SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada. Five Professional Development Courses will be held on Tuesday, June 5. Two courses are scheduled for the morning: "Interconnections: PCB and Solder -- Not Just Your Normal Failure Modes Any More" and "Stencil Printing -- Intermediate Topics: Process Troubleshooting and Defect Prevention." Three courses are slated for the afternoon: "Failure Analysis of Electronic Devices", "Understanding Shock & Vibration", and "Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies." Conference sessions on June 6 and 7 will cover Failure Modes, Reliability, Research from the Refined Manufacturing Acceleration Process (ReMAP) Consortium, Coating & Encapsulation, Imaging & Inspection, Solder and Solder Paste. A panel discussion on "Warpage Induced Defects and Component Warpage Limits" is organized for Wednesday with experts from Plexus, Rockwell Collins, and Akrometrix. Thursday's panel on "Low Melting Point Solder Pastes" will feature experts from Indium Corporation, Alpha Assembly Solutions, and Nihon Superior. Shawn Blakney, Senior Director of Global Technology and Innovation at Celestica, will provide the keynote presentation on Tuesday, June 5 on the topic of "The Automated and Digital Factory - Navigating Technology Disruption." The conference is co-located with the SMTA Ontario Expo on Wednesday, June 6, featuring 20 companies highlighting the latest manufacturing solutions. The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments. Visit the event website at https://www.smta.org/iceet/ for more information or contact Jenny Ng, jenny@smta.org, with questions or comments. SMTA -- A Global Association Working at a Local Level The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. SMTA More Information March 28, 2024 SMTA Europe Announces 2024 Spring Conferences The SMTA announces three conferences taking place in Europe this spring. The Advanced Electronics Assembly Conference (AEAC) will co-locate with InnoElectro, 24 April ... March 15, 2024 SMTA Announces Workforce Development Breakfast at UHDI Symposium The SMTA is excited to announce a Workforce Development Breakfast Panel, "Building Tomorrow's Expertise," taking place ... February 23, 2024 SMTA Capital Chapter Expo Showcases Innovation in Electronics Manufacturing The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled ... February 14, 2024 SMTA Introduces Ultra High Density Interconnect (UHDI) Symposium The SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High ... February 8, 2024 SMTA Carolinas Chapter In-Person Technical Meeting to Improve SMT Quality The Carolinas Chapter of the SMTA is hosting an evening dinner presentation on Thursday, February 22, 2024 from 6:00 - 8:00 pm ET at East West Charlotte in Mooresville, NC ... February 6, 2024 Best Papers from SMTA International Announced The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. ... December 18, 2023 Wafer-Level Packaging Symposium Program Announced The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The Hyatt ... December 14, 2023 SMTA Women's Leadership Program Announces Q1 Webinar Schedule for 2024 The SMTA announced speakers for the next three Wine Down Wednesday webinars taking place in 2024. These virtual meetups are open to everyone and free to attend ... December 12, 2023 SMTA Women's Leadership Program Announces Q1 Webinar Schedule for 2024 The SMTA announced speakers for the next three Wine Down Wednesday webinars taking place in 2024. These virtual meetups are open to everyone and free to attend ... November 10, 2023 SMTA Hosts Workforce Development Roundtable at Arizona Expo SMTA will host a roundtable discussion focused on workforce development challenges in Arizona during the SMTA Arizona ... |
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