We search for industry news, so you don't need to.
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure

ENIG? EPIG? Electroless palladium immersion gold is a new final finish for enhancing copper circuits solderability without electroless nickel. Paper contrasts ENIG and EPIG solderability, as-plated and following steam aging.
Complete this form to download this Technical Paper.

Your Name

Your E-mail

Your Company

Your State, or Country if outside USA

More Technical Papers and Webcasts
Openair-Plasma for Display and HMI Manufacturing
ISO Standards and the Case for Cost-Effective Delivery of Quality
Solder Bridging and Other Common Soldering Problems
Improve SMT Yield and Reduce Defects
High Power Density Aerospace Solution
Eliminating Ni Corrosion in ENIG/ENEPIG Using RAIG
A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal Coating on PCBs
Reliable Nickel-free Surface Finish Solution for High Frequency-HDI PCB Applications
The Benefits of Plasma Treatment in Electronics Manufacturing

Full Technical Paper List