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Comparing Soldering Results of ENIG and EPIG Post Steam Exposure

ENIG? EPIG? Electroless palladium immersion gold is a new final finish for enhancing copper circuits solderability without electroless nickel. Paper contrasts ENIG and EPIG solderability, as-plated and following steam aging.
Uyemura
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Comparing Soldering Results of ENIG and EPIG Post Steam Exposure

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