Marketplace Index
Adhesives & Epoxies
Analytical & Laboratory
Artwork & Photo Tooling
Associations & Organizations
Barcode, Scanning, RFID
CAD, CAM, CIM, EDA
Chemicals & Treatment
Circuit Board Handling
Clean Room & Fume Extraction
Cleaning & Solvents
Coating, Dispensing & Masking
Component Insertion
Component Prep & Counting
Components & Hardware
Consulting & Market Research
Data Acquisition
Die Bonding
Distributors & Representatives
Drilling, Routing & Dicing
Electronics Manuf. Services
Embedded Technology
ESD & EOS
Feeders
Flexible Circuits
Flip Chip
Foils, Laminates & Lamination
Gases
Hand Tools & Shop Supplies
Inspection & Measurement
Labeling, Ink & Marking
Lasers
Lease, Refurbishment & Resale
Material Handling
Odd Form Placement
Ovens, Curing & Drying
Packaging & Encapsulating
PCB Fabrication
Personnel & Staffing
Photo Imaging & Resist
Pick & Place
Plating & Wet Processes
Publications
Reclaimation & Recovery
Rework & Repair
Robots
Software
Soldering, Automated
Soldering, Manual
Solders & Fluxes
Stencil & Screen Printing
Tape & Reel
Test, Automated
Test, Manual
Thick Film
Tooling & Fixtures
Training, Education & Compliance
Wire & Cable Harness
Wire Cutting & Stripping
Work Stations & Benches
X-ray & XRF
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Die Bonding
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Equipment and services for attaching semiconductor die to its package or to some substrate such as tape carrier.
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F & K Delvotec Inc.
Supplies wire bonders, die bonders and pull/shear testers.
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Orthodyne Electronics
Manufactures robotic ultrasonic wire bonders for semiconductor and microelectronic applications.
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Umicore AG & Co. KG
Microbond soft solders for die and clip attach of power devices. Duksan solder spheres for CSP and BGA. Waferbumping solder paste, Flux and spheres.
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