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Adhesives & Epoxies
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Adhesives, epoxies, glues, tapes and materials for bonding including high temperature epoxy adhesives, structural, flexible, rigid and cyanoacrylate epoxy adhesives.
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CAPLINQ Corporation
Supplies an entire array of consumable materials for both the manufacture of semiconductor devices as well as for for general industrial use.
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CircuitMedic
Circuit board repair and rework kits including epoxies and replacement circuits to repair damaged surface mount and BGA pads, base board, plated holes and gold edge contacts, BGA rework stencils and jumper wires.
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Dymax Corporation
Manufacturers industrial adhesives including UV curable adhesives, epoxy resins, cyanoacrylates and activator-cured adhesives.
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Emerson & Cuming
Provides adhesives, coatings and encapsulants for circuit and component assembly applications.
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Epoxy Technology, Inc
Founded in 1966 as the world’s first supplier of electrically conductive epoxies for use as die-attach adhesives in hybrid microelectronics, semiconductor packaging and assembly.
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Henkel Corporation
Solder and fluxes, surface mount adhesives, conformal coatings, potting compounds, thermally conductive materials, phase change thermal interface materials, encapsulants, underfills and coating powders.
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Heraeus, Inc. CIRCUIT MATERIALS DIVISION
Manufacturer of solder pastes, adhesives and fluxes for the SMT industry.
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Hexion Specialty Chemicals
Supplier of high purity Phenol-Formaldehyde (Phenolic) resins for the electronics industry.
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INTERTRONICS
Offers a range of adhesives, encapsulants, coatings, sealants and tapes as well as the associated dispensing, curing and surface preparation equipment and materials used in the manufacturing and assembly processes.
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Kaneka Texas Corporation
Offers plastic materials through research manufacturing and marketing of environmentally acceptable innovative chemical intermediates.
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Tesa AG
Supplies adhesive films and adhesive tapes.
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Umicore AG & Co. KG
Microbond soft solders for die and clip attach of power devices. Duksan solder spheres for CSP and BGA. Waferbumping solder paste, Flux and spheres.
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