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Finetech, Inc.
Suppliers of flip chip bonder/rework systems.
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Marketplace Categories
Flip Chip
Rework & Repair
This page has been viewed 212 times.
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October 31, 2008
High Accuracy Die Bonder on display at IMAPS 2008
FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 210 at the upcoming IMAPS 2008, November 2 to 6, 2008,...
FINETECH
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September 22, 2008
FINETECH to Demonstrate Compact Rework System at IPC Midwest
FINETECH will exhibit the FINEPLACER® CRS 10 Compact Rework System in booth #809 at IPC Midwest 2008, scheduled for September 24-25, 2008 in ...
FINETECH
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September 4, 2008
Scott Kenter Joins FINETECH as Applications Engineer
FINETECH announces that Scott Kentner has joined the Manchester, NH team as Applications Engineer. In his new position, Scott will work closely ...
FINETECH
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May 30, 2008
FINETECH Opens East Coast Applications and Demo Facility
FINETECH announces the opening of a new facility in Manchester, New Hampshire. As FINETECH continues to grow its US operations, it ...
FINETECH
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April 8, 2008
FINEPLACER® CRS at NEPCON China
FINETECH announces that it will display the FINEPLACER® CRS7.MD system at the upcoming NEPCON China 2008 trade show and exhibition, ...
FINETECH
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April 7, 2008
FINEVIEW® Asian Premiere at NEPCON China
FINETECH announces FINEVIEW® video microscope station will make its Asian premiere at the upcoming NEPCON China 2008 trade show and ...
FINETECH
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April 4, 2008
FINEPLACER® Lambda at NEPCON China
FINETECH announces that it will display the FINEPLACER® Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled ...
FINETECH
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March 24, 2008
Finetech to Demonstrate Compact Rework System at APEX
FINETECH will display the Fineplacer® CRS 10 Compact Rework System in booth #577 at APEX 2008, scheduled for April 1-3, 2008 in Las Vegas ...
FINETECH
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March 10, 2008
FINETECH Shanghai to Display FINEPLACER® Pico MA at SEMICON China
FINETECH Shanghai announces it will showcase FINEPLACER® Pico MA in Booth 2166 at the upcoming SEMICON China 2008 Exhibition and ...
FINETECH
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March 7, 2008
FINETECH Shanghai to Exhibit High Accuracy Die Bonder at SEMICON China
FINETECH Shanghai announces it will showcase FINEPLACER® Lambda with a placement accuracy better than +/- 0.5 micron in Booth 2166 at the ...
FINETECH
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